Assembly of objects by means of a sealing bead comprising intermetallic compounds

The assembly (10) has a connection element i.e. sealing bead (108), comprising a material portion (116) including intermetallic compounds of phase made of brazing metal e.g. tin, and another metal e.g. nickel or copper, where a fusion point of the latter metal is greater than that of the brazing met...

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Bibliographische Detailangaben
Hauptverfasser:	BAILLIN, XAVIER, SIBUET, HENRI, SILLON, NICOLAS
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The assembly (10) has a connection element i.e. sealing bead (108), comprising a material portion (116) including intermetallic compounds of phase made of brazing metal e.g. tin, and another metal e.g. nickel or copper, where a fusion point of the latter metal is greater than that of the brazing metal. The connection element has another material portion (118) including metal e.g. gold. The latter material portion is in contact with objects e.g. silicon substrate (102) and cover (106). The former material portion is arranged between the latter material portion and one of metal walls (110). An independent claim is also included for a method for assembling objects.