CURING COMPOSITIONS HAVING LOW-FREE AMOUNTS OF METHYLENEDIANILINE

A process for preparing a curing composition of a coordination complex comprising methylenedianiline (MDA) and a salt, and less than 1000 of free MDA. The curing composition may be used in curing polyurethanes and epoxy resins.

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Bibliographische Detailangaben
Hauptverfasser:	SHAH, MUKUND, ROSENBERG, RONALD, O, DOYLE, THOMAS, R
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A process for preparing a curing composition of a coordination complex comprising methylenedianiline (MDA) and a salt, and less than 1000 of free MDA. The curing composition may be used in curing polyurethanes and epoxy resins.