MULTI-CIRCUIT HEAT EXCHANGER

A baffle assembly is disposed within a manifold of a multi-circuit heat exchanger for dividing the interior volume of that manifold into a first chamber associated with one circuit and a second chamber associated with another circuit. The baffle assembly includes a pair of baffle members that extend...

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Bibliographische Detailangaben
Hauptverfasser: KOONS, SCOTT, BUSSJAGER, RUDY C
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A baffle assembly is disposed within a manifold of a multi-circuit heat exchanger for dividing the interior volume of that manifold into a first chamber associated with one circuit and a second chamber associated with another circuit. The baffle assembly includes a pair of baffle members that extend generally transversely across the interior volume of the manifold are disposed in spaced apart relationship thereby forming a void space therebetween. The void space is in fluid communication with a region exterior of that manifold whereby any fluid leaking from either of the first or second chamber into the void space will be vented therefrom.