A three-dimensional adhesive device having a microelectronic system embedded therein
Accordingly, the present invention relates to a three-dimensional adhesive device to be attached to the body surface of a mammal comprising a microelectronic sensing system characterized by (a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bott...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!