A three-dimensional adhesive device having a microelectronic system embedded therein
Accordingly, the present invention relates to a three-dimensional adhesive device to be attached to the body surface of a mammal comprising a microelectronic sensing system characterized by (a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bott...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Accordingly, the present invention relates to a three-dimensional adhesive device to be attached to the body surface of a mammal comprising a microelectronic sensing system characterized by
(a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bottom surface;
(b) a microelectronic system embedded in the body of the pressure sensitive adhesive;
(c) one or more cover layer(s) attached to the upper surface; and
(d) optionally a release liner releasable attached to the bottom surface of the adhesive device. Suitably the microelectronic system is a microelectronic sensing system capable of sensing physical input such as pressure, vibration, sound, electrical activity (e.g. from muscle activity), tension, blood-flow, moisture, temperature, enzyme activity, bacteria, pH, blood sugar, conductivity, resistance, capacitance, inductance or other chemical, biochemical, biological, mechanical or electrical properties. |
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