CASTING RESIN SYSTEM FOR INSULATING MATERIAL

A casting resin for switchboards contains bisphenol F fluid epoxy resin. The properties of the casting resin can be significantly improved compared to bisphenol A-based casting resins, in particular regarding glass transition temperature and temperature shock resistance. More specifically, the glass...

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Bibliographische Detailangaben
1. Verfasser:	SWIATKOWSKI, GERNOT
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A casting resin for switchboards contains bisphenol F fluid epoxy resin. The properties of the casting resin can be significantly improved compared to bisphenol A-based casting resins, in particular regarding glass transition temperature and temperature shock resistance. More specifically, the glass transition temperature is advantageously increased for significantly better performance.