Apparatus and method for controlling temperature uniformity of substrates

An apparatus and method for providing substantially uniform substrate temperature in a chemical vapor deposition reaction chamber is provided. The method and apparatus utilize a carrier (110) for holding substrate (160) in the reaction chamber and a plurality of heating elements (120, 130, 140) arra...

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Bibliographische Detailangaben
Hauptverfasser:	PATEL, AMEESH N, RAMER, JEFFREY C, BOGUSLAVSKIY, VADIM, GURARY, ALEXANDER
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COLORIMETRY CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PHYSICS RADIATION PYROMETRY SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TESTING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus and method for providing substantially uniform substrate temperature in a chemical vapor deposition reaction chamber is provided. The method and apparatus utilize a carrier (110) for holding substrate (160) in the reaction chamber and a plurality of heating elements (120, 130, 140) arranged to heat the carrier and the substrate. A substrate pyrometer (138, 139) measures the temperature of the substrates to provide a signal representing the process temperature. This signal is sued in a feedback loop (151, 134, 132) to control one or more of the heating elements. At least two carrier pyrometers (126, 136, 146) focused at different zones of the carrier are provided. The signals from the carrier pyrometers are compared to provide an indication of temperature non-uniformity. This indication is used in a separate feedback loop (149, 124, 122) to adjust other heating elements so as to maintain temperature uniformity across the carrier.