METHOD FOR THE CONTACTING OF INSULATED WIRES BY APPLYING A SPHERICAL OR MUSHROOM-SHAPED COATING TO THE WIRE

The invention allows for the contacting of preferably microcomponents using electrical wires. By growing metallic microdepositions on cut surfaces of microcables, a contact region is generated which simplifies the dosing and application of a contact auxiliary and allows ultrasonic bonding, comprisin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ROSSNER, TIM, MEISS, THORSTEN
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The invention allows for the contacting of preferably microcomponents using electrical wires. By growing metallic microdepositions on cut surfaces of microcables, a contact region is generated which simplifies the dosing and application of a contact auxiliary and allows ultrasonic bonding, comprising a defined size of the electrically conductive area and allowing the contacting of very stably insulated wires. The application of this method in a panelized manner and in series is inexpensive.