METHOD FOR THE CONTACTING OF INSULATED WIRES BY APPLYING A SPHERICAL OR MUSHROOM-SHAPED COATING TO THE WIRE
The invention allows for the contacting of preferably microcomponents using electrical wires. By growing metallic microdepositions on cut surfaces of microcables, a contact region is generated which simplifies the dosing and application of a contact auxiliary and allows ultrasonic bonding, comprisin...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The invention allows for the contacting of preferably microcomponents using electrical wires. By growing metallic microdepositions on cut surfaces of microcables, a contact region is generated which simplifies the dosing and application of a contact auxiliary and allows ultrasonic bonding, comprising a defined size of the electrically conductive area and allowing the contacting of very stably insulated wires. The application of this method in a panelized manner and in series is inexpensive. |
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