INTEGRATED CIRCUIT WITH SPURIOUS ACOUSTIC MODE SUPPRESSION AND METHOD OF MANUFACTURE THEREOF

An integrated circuit (IC) apparatus includes a substrate having opposed first and second major sides and one or more edges defining an outer periphery of the substrate. The substrate may be a semiconductor material. The IC apparatus may further include one or more transducers situated on the first...

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Bibliographische Detailangaben
Hauptverfasser:	CHEN, JIE, OSSMAN, WILLIAM, SAVORD, BERNIE J, SOLOMON, ROD J
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACOUSTICS ACOUSTICS NOT OTHERWISE PROVIDED FOR FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL MUSICAL INSTRUMENTS PERFORMING OPERATIONS PHYSICS SOUND-PRODUCING DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	An integrated circuit (IC) apparatus includes a substrate having opposed first and second major sides and one or more edges defining an outer periphery of the substrate. The substrate may be a semiconductor material. The IC apparatus may further include one or more transducers situated on the first major side of the substrate; and an attenuation pattern formed in at least one of the second major side and one or more of the edges of the substrate.