Chassis with distributed jet cooling

A chassis (10) with distributed jet cooling is provided. The chassis includes one or more sidewalls (12) defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins (14) thermally...

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Bibliographische Detailangaben
Hauptverfasser:	GERSTLER, WILLIAM DWIGHT, WHALEN, BRYAN PATRICK, LI, RI, SCHROEDER, CHRISTINA CLYDE, VANDER PLOEG, BENJAMIN JON, NICEWARNER, EARL ROSS, ARIK, MEHMET
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A chassis (10) with distributed jet cooling is provided. The chassis includes one or more sidewalls (12) defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins (14) thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly (30) comprising a multi-orifice synthetic jet (30) or a number of single orifice synthetic jets (2) disposed on a side (15, 16) of a respective one of the array(s) of fins. The chassis further includes at least one attachment means (4, 6, 9, 11, 20, 44) for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.