Housing for vacuum encapsulation of an electromechanical microsystem, associated assembly and method for detecting a solder problem in such an assembly

Bibliographische Detailangaben

Hauptverfasser:	Leduc, Dominique, Leverrier, Bertrand
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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