Semiconductor Die Package
A die package, comprising: a die (105) having a lower surface; and a diepad (111) having a body portion and an island portion extending outward from the body portion, the island portion having a top surface, wherein the lower surface of the die faces and is joined to the top surface of the diepad (1...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | A die package, comprising:
a die (105) having a lower surface; and
a diepad (111) having a body portion and an island portion extending outward from the body portion, the island portion having a top surface,
wherein the lower surface of the die faces and is joined to the top surface of the diepad (111). |
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