DUAL METAL INTERCONNECTS
Embodiments of apparatus and methods for forming dual metal interconnects are described herein. Other embodiments may be described and claimed.
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| creator | INDUKURI, Tejaswi FAJARDO, Arnel M O'BRIEN, Kevin, P AKOLKAR, Rohan, N |
| description | Embodiments of apparatus and methods for forming dual metal interconnects are described herein. Other embodiments may be described and claimed. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2356674B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2356674B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2356674B13</originalsourceid><addsrcrecordid>eNrjZJBwCXX0UfB1DQGSnn4hrkHO_n5-rs4hwTwMrGmJOcWpvFCam0HBzTXE2UM3tSA_PrW4IDE5NS-1JN41wMjY1MzM3MTJ0JgIJQC5KB9j</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DUAL METAL INTERCONNECTS</title><source>esp@cenet</source><creator>INDUKURI, Tejaswi ; FAJARDO, Arnel M ; O'BRIEN, Kevin, P ; AKOLKAR, Rohan, N</creator><creatorcontrib>INDUKURI, Tejaswi ; FAJARDO, Arnel M ; O'BRIEN, Kevin, P ; AKOLKAR, Rohan, N</creatorcontrib><description>Embodiments of apparatus and methods for forming dual metal interconnects are described herein. Other embodiments may be described and claimed.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231011&DB=EPODOC&CC=EP&NR=2356674B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231011&DB=EPODOC&CC=EP&NR=2356674B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>INDUKURI, Tejaswi</creatorcontrib><creatorcontrib>FAJARDO, Arnel M</creatorcontrib><creatorcontrib>O'BRIEN, Kevin, P</creatorcontrib><creatorcontrib>AKOLKAR, Rohan, N</creatorcontrib><title>DUAL METAL INTERCONNECTS</title><description>Embodiments of apparatus and methods for forming dual metal interconnects are described herein. Other embodiments may be described and claimed.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBwCXX0UfB1DQGSnn4hrkHO_n5-rs4hwTwMrGmJOcWpvFCam0HBzTXE2UM3tSA_PrW4IDE5NS-1JN41wMjY1MzM3MTJ0JgIJQC5KB9j</recordid><startdate>20231011</startdate><enddate>20231011</enddate><creator>INDUKURI, Tejaswi</creator><creator>FAJARDO, Arnel M</creator><creator>O'BRIEN, Kevin, P</creator><creator>AKOLKAR, Rohan, N</creator><scope>EVB</scope></search><sort><creationdate>20231011</creationdate><title>DUAL METAL INTERCONNECTS</title><author>INDUKURI, Tejaswi ; FAJARDO, Arnel M ; O'BRIEN, Kevin, P ; AKOLKAR, Rohan, N</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2356674B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>INDUKURI, Tejaswi</creatorcontrib><creatorcontrib>FAJARDO, Arnel M</creatorcontrib><creatorcontrib>O'BRIEN, Kevin, P</creatorcontrib><creatorcontrib>AKOLKAR, Rohan, N</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>INDUKURI, Tejaswi</au><au>FAJARDO, Arnel M</au><au>O'BRIEN, Kevin, P</au><au>AKOLKAR, Rohan, N</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DUAL METAL INTERCONNECTS</title><date>2023-10-11</date><risdate>2023</risdate><abstract>Embodiments of apparatus and methods for forming dual metal interconnects are described herein. Other embodiments may be described and claimed.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | DUAL METAL INTERCONNECTS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T09%3A11%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=INDUKURI,%20Tejaswi&rft.date=2023-10-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2356674B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |