DUAL METAL INTERCONNECTS

Embodiments of apparatus and methods for forming dual metal interconnects are described herein. Other embodiments may be described and claimed.

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Bibliographische Detailangaben
Hauptverfasser:	INDUKURI, Tejaswi, FAJARDO, Arnel M, O'BRIEN, Kevin, P, AKOLKAR, Rohan, N
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Embodiments of apparatus and methods for forming dual metal interconnects are described herein. Other embodiments may be described and claimed.