Connection between a thermoelectric element and a heat exchanger

The connection (1) has a heat conducting unit (6) arranged between a ceramic carrier layer (4) and a heat exchanger wall (5). The heat conducting unit connects the ceramic carrier layer and the heat exchanger wall in a material-fit manner. The heat conducting unit forms homogenous heat conducting la...

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Bibliographische Detailangaben
Hauptverfasser: RICHTER, BJÖRN, PRZYBYLSKI, SVEN
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:The connection (1) has a heat conducting unit (6) arranged between a ceramic carrier layer (4) and a heat exchanger wall (5). The heat conducting unit connects the ceramic carrier layer and the heat exchanger wall in a material-fit manner. The heat conducting unit forms homogenous heat conducting layer and comprises heat conductivity of more than 10 watt per meter Kelvin. The heat conducting unit is an alloy containing gallium and indium. The alloy comprises tin, and the heat exchanger wall is formed from a metallic carrier substrate.