Connection between a thermoelectric element and a heat exchanger
The connection (1) has a heat conducting unit (6) arranged between a ceramic carrier layer (4) and a heat exchanger wall (5). The heat conducting unit connects the ceramic carrier layer and the heat exchanger wall in a material-fit manner. The heat conducting unit forms homogenous heat conducting la...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The connection (1) has a heat conducting unit (6) arranged between a ceramic carrier layer (4) and a heat exchanger wall (5). The heat conducting unit connects the ceramic carrier layer and the heat exchanger wall in a material-fit manner. The heat conducting unit forms homogenous heat conducting layer and comprises heat conductivity of more than 10 watt per meter Kelvin. The heat conducting unit is an alloy containing gallium and indium. The alloy comprises tin, and the heat exchanger wall is formed from a metallic carrier substrate. |
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