MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL BATCH MOUNTING METHOD AND BATCH MOUNTING DEVICE

A micro-ball (2) remained on a suction plate (11) is removed using a ball removal implement (9) having a wire section that is stretched under tension, by bringing a wire (17) into contact with the micro-ball (2) remained on the suction plate (11), while moving the ball removal implement (9) in relat...

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Bibliographische Detailangaben
Hauptverfasser:	ISHIKAWA, SHINJI, HASHINO, EIJI, TATSUMI, KOHEI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A micro-ball (2) remained on a suction plate (11) is removed using a ball removal implement (9) having a wire section that is stretched under tension, by bringing a wire (17) into contact with the micro-ball (2) remained on the suction plate (11), while moving the ball removal implement (9) in relation to the suction plate (11) and moving the wire (17) in the wire section by extending and retracting the wire.