Endpoint detection for photomask etching

Apparatus and method for endpoint detection are provided for photomask etching. The apparatus provides a plasma etch chamber (10; 900; 2500) with a substrate support member. The substrate support member has at least two optical components disposed therein for use in endpoint detection. Enhanced proc...

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Bibliographische Detailangaben
1. Verfasser: GRIMBERGEN, MICHAEL N
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Apparatus and method for endpoint detection are provided for photomask etching. The apparatus provides a plasma etch chamber (10; 900; 2500) with a substrate support member. The substrate support member has at least two optical components disposed therein for use in endpoint detection. Enhanced process monitoring for photomask etching are achieved by the use of various optical measurement techniques for monitoring at different locations of the photomask.