Cooking device with a component that heats up during operation and method for cooling such a component

The cooking device i.e. microwave oven (1), has a cooling air blower (13) for cooling a circuit carrier (11) and a power semiconductor component (12) that are heated during operation of the cooking device. The circuit carrier and the semiconductor component are temporarily cooled by a heat pipe (14)...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: de Vries, Markus, Dengler, Klaus, Steinbeck, Martin-Ernst, Hangl, Felix
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The cooking device i.e. microwave oven (1), has a cooling air blower (13) for cooling a circuit carrier (11) and a power semiconductor component (12) that are heated during operation of the cooking device. The circuit carrier and the semiconductor component are temporarily cooled by a heat pipe (14) in after-run-time of the cooling air blower in an operating mode. The heat pipe is connected with a control unit (15). The heat pipe is arranged electrically isolated from the circuit carrier and the semiconductor component. An independent claim is also included for a method for cooling a circuit carrier and a power semiconductor component of a cooking device.