Method for producing a contact area of an electronic component

Forming local contact area(s) (20) of a substrate (10) of an electrical component comprises contacting the substrate, on the contact side, with a sintered porous layer (12) comprising aluminum; and compacting and/or removing the sintered porous layer in the contact area to be formed by concentrated...

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Bibliographische Detailangaben
Hauptverfasser:	Teppe, Andreas, Roth, Peter, Bagus, Stefan, Metz, Axel, Droste, Tobias, Dauwe, Stefan
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Forming local contact area(s) (20) of a substrate (10) of an electrical component comprises contacting the substrate, on the contact side, with a sintered porous layer (12) comprising aluminum; and compacting and/or removing the sintered porous layer in the contact area to be formed by concentrated electromagnetic radiation.