SANDWICH PIEZOELECTRIC DEVICE WITH SOLID COPPER ELECTRODE

Disclosed are apparatus and methodology for minimizing and compensating for cracking in piezoelectric devices so as to maintain long term functionality of the devices. Compensation for cracking is achieved by applying solid conductive electrodes over the entire surface of the piezoelectric device and extending the electrodes beyond the perimeter of the piezoelectric device. In this way electrical connections are maintained even in the presence of cracking. Cracking of the piezoelectric device is limited by minimizing the local bending moment of the piezoelectric device by way of applying insulative support materials that may vary in thickness.