Method for producing a hole

A process for producing a hole (7) in a component (1) comprises using a pulsed energy beam (22), especially a laser. During material removal, different pulse lengths are used at the start to the finish. When the short pulses are used, the beam is moved over the whole surface.

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Bibliographische Detailangaben
Hauptverfasser: BECK, THOMAS, WOLKERS, LUTZ DR, SETTEGAST, SILKE
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A process for producing a hole (7) in a component (1) comprises using a pulsed energy beam (22), especially a laser. During material removal, different pulse lengths are used at the start to the finish. When the short pulses are used, the beam is moved over the whole surface.