Method of and apparatus for removing a metal oxide from a treating surface of a substrate ; Method of reducing metal oxides and forming a solder joint in a substrate

Described herein are a method and an apparatus for removing metal oxides and/or forming solder joints on at least a portion of a substrate surface (300) within a target area. In one particular embodiment, the method and apparatus to reduce metal oxides and form a solder joint within a substrate comp...

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Bibliographische Detailangaben
Hauptverfasser:	DONG, CHUN CHRISTINE, GHOSH, RANAJIT, ARSLANIAN, GREGORY KHOSROV
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Described herein are a method and an apparatus for removing metal oxides and/or forming solder joints on at least a portion of a substrate surface (300) within a target area. In one particular embodiment, the method and apparatus to reduce metal oxides and form a solder joint within a substrate comprising a layer having a plurality of solder bumps by providing one or more energizing electrodes (302) and exposing at least a portion of the layer and solder bumps to the energizing electrode (302).