PACKAGED SEMICONDUCTOR PRODUCT AND METHOD FOR MANUFACTURE THEREOF

Packaged semiconductor product (2) including a first semiconductor device (4A) and a packaging structure with a protective envelope (6) and a first and second external electrode (8,10). The first semiconductor device (4A) has a first substrate (11A) and is provided with a first passivation layer (12...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	POMMIER, MICKAEL, BELLENGER, STEPHANE, YANNOU, JEAN-MARC, PIERAERTS, ERIC
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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