PACKAGED SEMICONDUCTOR PRODUCT AND METHOD FOR MANUFACTURE THEREOF

PACKAGED SEMICONDUCTOR PRODUCT AND METHOD FOR MANUFACTURE THEREOF

Packaged semiconductor product (2) including a first semiconductor device (4A) and a packaging structure with a protective envelope (6) and a first and second external electrode (8,10). The first semiconductor device (4A) has a first substrate (11A) and is provided with a first passivation layer (12...

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Bibliographische Detailangaben
Hauptverfasser: POMMIER, MICKAEL, BELLENGER, STEPHANE, YANNOU, JEAN-MARC, PIERAERTS, ERIC
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Packaged semiconductor product (2) including a first semiconductor device (4A) and a packaging structure with a protective envelope (6) and a first and second external electrode (8,10). The first semiconductor device (4A) has a first substrate (11A) and is provided with a first passivation layer (12A) and a first electronic structure. The first substrate has a first main surface (14). The first substrate (11A) is embedded in the protective envelope (6) and the first main surface (14) faces a first opening (23) of the protective envelope (6). The first electronic structure has a first and a second contact region (20, 22) for electrically contacting the first electronic structure. The first passivation layer (12A) substantially covers the first main surface (14) and the first electronic structure. The protective envelope (6) extends between the first passivation layer (12A) and the first external electrode (8) towards the first contact region (20).