Camera device
The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis t...
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creator | VAN DER SIJDE, ARJEN G WOLTERINK, EDWIN M DOHMEN, GERARDUS M SANDER, ALOYSIUS F.M VAN ARENDONK, ANTON P.M GROOT, ERIK H DE BRUIN, LEENDERT |
description | The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out. |
format | Patent |
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The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110112&DB=EPODOC&CC=EP&NR=2273555A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110112&DB=EPODOC&CC=EP&NR=2273555A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VAN DER SIJDE, ARJEN G</creatorcontrib><creatorcontrib>WOLTERINK, EDWIN M</creatorcontrib><creatorcontrib>DOHMEN, GERARDUS M</creatorcontrib><creatorcontrib>SANDER, ALOYSIUS F.M</creatorcontrib><creatorcontrib>VAN ARENDONK, ANTON P.M</creatorcontrib><creatorcontrib>GROOT, ERIK H</creatorcontrib><creatorcontrib>DE BRUIN, LEENDERT</creatorcontrib><title>Camera device</title><description>The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOB1TsxNLUpUSEkty0xO5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BRkbmxqampo5GxkQoAQDg-h1x</recordid><startdate>20110112</startdate><enddate>20110112</enddate><creator>VAN DER SIJDE, ARJEN G</creator><creator>WOLTERINK, EDWIN M</creator><creator>DOHMEN, GERARDUS M</creator><creator>SANDER, ALOYSIUS F.M</creator><creator>VAN ARENDONK, ANTON P.M</creator><creator>GROOT, ERIK H</creator><creator>DE BRUIN, LEENDERT</creator><scope>EVB</scope></search><sort><creationdate>20110112</creationdate><title>Camera device</title><author>VAN DER SIJDE, ARJEN G ; WOLTERINK, EDWIN M ; DOHMEN, GERARDUS M ; SANDER, ALOYSIUS F.M ; VAN ARENDONK, ANTON P.M ; GROOT, ERIK H ; DE BRUIN, LEENDERT</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2273555A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>VAN DER SIJDE, ARJEN G</creatorcontrib><creatorcontrib>WOLTERINK, EDWIN M</creatorcontrib><creatorcontrib>DOHMEN, GERARDUS M</creatorcontrib><creatorcontrib>SANDER, ALOYSIUS F.M</creatorcontrib><creatorcontrib>VAN ARENDONK, ANTON P.M</creatorcontrib><creatorcontrib>GROOT, ERIK H</creatorcontrib><creatorcontrib>DE BRUIN, LEENDERT</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>VAN DER SIJDE, ARJEN G</au><au>WOLTERINK, EDWIN M</au><au>DOHMEN, GERARDUS M</au><au>SANDER, ALOYSIUS F.M</au><au>VAN ARENDONK, ANTON P.M</au><au>GROOT, ERIK H</au><au>DE BRUIN, LEENDERT</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Camera device</title><date>2011-01-12</date><risdate>2011</risdate><abstract>The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES |
title | Camera device |
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