ROBUST METAL FILM ENCAPSULATION

The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The pres...

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Bibliographische Detailangaben
Hauptverfasser:	SNYDER, SHAWN, W, BRADOW, TIMOTHY, N, BRANTNER, PAUL, C, NEUDECKER, BERND, J, KEATING, JOSEPH, A, NARAYAN, PRATIVADI, B
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRICITY PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
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Beschreibung
Zusammenfassung:	The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The present invention may further include ways of providing heat and pressure resilience to the bonding layer and improving the robustness of the protection for the cell structure.