Electric component mounting apparatus

The present invention provides a mounting device capable of highly reliable mounting a plurality of electrical components using an adhesive agent. The present invention is a mounting device including a thermocompression bonding head (4) having a pressure bonding member (6) made of a predetermined elastomer provided in a head main body (5), and the mounting device is constructed such that an IC chip (20) placed on a wiring board (10) is pressed by the pressure bonding member (6) at a predetermined pressure, and further includes a pressing force adjusting mechanism for adjusting pressing force corresponding to a region on a pressure bonding surface (6a) of the pressure bonding member (6). A pressing force adjusting mechanism can be used in which a plurality of pressing force adjusting frames (5a,50) are provided in the head main body (5), wherein the pressing force adjusting frames (5a,50) are buried inside the pressure bonding member (6) and have differentiated heights.