Reactive hot-melt adhesive

A hot melt adhesive composition is disclosed that includes a combination of one or more high molecular weight components, high levels of one or more multifunctional polyols, one or more organic compounds having a least one hydroxy functional group and high levels of one or more polyisocyanates, with...

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Bibliographische Detailangaben
Hauptverfasser:	Richards, James L, Kesselmayer, Mark A
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A hot melt adhesive composition is disclosed that includes a combination of one or more high molecular weight components, high levels of one or more multifunctional polyols, one or more organic compounds having a least one hydroxy functional group and high levels of one or more polyisocyanates, with each corresponding ingredient adjusted in specified ways that provides an unexpected balance of properties required for bonding structural components.