HEAT-INSULATING MATERIAL

The present invention is a resin foam where a porosity (X) is not less than 80%, having a cell (L) with a cell diameter of not less than 1 µm and not more than 1000 µm, and a cell (S) with a cell diameter of not less than 0.01 µm and less than 1 µm. The present invention aims at providing a resin fo...

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Bibliographische Detailangaben
Hauptverfasser: SHINO, KAZUHIRO, KIMURA, MASAHIRO, NAKAMURA, HIROKADO
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present invention is a resin foam where a porosity (X) is not less than 80%, having a cell (L) with a cell diameter of not less than 1 µm and not more than 1000 µm, and a cell (S) with a cell diameter of not less than 0.01 µm and less than 1 µm. The present invention aims at providing a resin foam excellent in thermal insulation performance and environmental performance, further, to provide a non Freon thermal insulation foam material maintaining the excellent thermal insulation performance for a long period of time and not generating condensation easily, and is characterized in a resin foam where a porosity (X) is not less than 80%, having a cell (L) with a cell diameter of not less than 1 µm and not more than 1000 µm, and a cell (S) with a cell diameter of not less than 0.01 µm and less than 1 µm.