HIGH-SPEED BACKPLANE CONNECTOR

A terminal module for assembly into a high-speed electrical connector having a contact receiving first contact pair and second contact pair, the second contact pair being in electrical communication with the first contact pair via a corresponding pair of contact interconnections. The contact interconnections have a substantially identical length of the corresponding pair and are arranged within parallel planes. The module further includes a shielding member arranged and disposed in close proximity to at least three edges of one or more of the first contact pair, the second contact pair and the contact interconnections to provide shielding. A housing member is arranged and disposed to receive backplane contacts via contact receiving apertures. The housing member is engaged with the first contact pair to receive the contacts into the contacts of the first contact pair. A backplane having grounding plate grid is also disclosed.