CHEMICAL-MECHANICAL PLANARIZATION PAD

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Hauptverfasser: JIN, MARC, C, WELLS, DAVID, ADAM, LEFEVRE, PAUL, HSU, OSCAR, K, ALDEBORGH, JOHN, ERIK
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Sprache:eng ; fre ; ger
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creator JIN, MARC, C
WELLS, DAVID, ADAM
LEFEVRE, PAUL
HSU, OSCAR, K
ALDEBORGH, JOHN, ERIK
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language eng ; fre ; ger
recordid cdi_epo_espacenet_EP2242615A4
source esp@cenet
subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
title CHEMICAL-MECHANICAL PLANARIZATION PAD
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