CHEMICAL-MECHANICAL PLANARIZATION PAD

Bibliographische Detailangaben

Hauptverfasser:	JIN, MARC, C, WELLS, DAVID, ADAM, LEFEVRE, PAUL, HSU, OSCAR, K, ALDEBORGH, JOHN, ERIK
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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