Method and apparatus for cooling electronic components

A cooling assembly comprises a first set of electronic components coupled with a substrate; a spray evaporative cooling cap assembly coupled with the first set of electronic components; a cold plate coupled with the substrate; a second set of electronic components thermally coupled with the cold pla...

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Bibliographische Detailangaben
1. Verfasser:	PAUTSCH, GREGORY W
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A cooling assembly comprises a first set of electronic components coupled with a substrate; a spray evaporative cooling cap assembly coupled with the first set of electronic components; a cold plate coupled with the substrate; a second set of electronic components thermally coupled with the cold plate; cooling fluid within the spray evaporative cooling cap assembly and the cold plate, the spray evaporative cooling cap assembly configured to direct the cooling fluid against a surface of the first set of electronic components; and a fluid conditioning unit associated with the spray evaporative cooling cap assembly.