IMPRINTING DEVICE AND IMPRINTING METHOD

The present invention provides an imprinting device and an imprinting method which can uniformly apply pressure between a mold and a molding object and which can increase/decrease a temperature at a fast speed. An imprinting device (1) is for transferring a pattern on a mold (100) to a film molding...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KANAI, AKIHIKO, TANAKA, SATORU, TAKAYA, YOSHIAKI, HASHIMA, YUJI, HAYASHIDA, YOSHIHISA, UEHARA, KAZUAKI, KAWAGUCHI, HIROSUKE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MATERIALS THEREFOR MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES MICROSTRUCTURAL TECHNOLOGY NANOTECHNOLOGY ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention provides an imprinting device and an imprinting method which can uniformly apply pressure between a mold and a molding object and which can increase/decrease a temperature at a fast speed. An imprinting device (1) is for transferring a pattern on a mold (100) to a film molding object (200), and comprises a stage (11) for holding the mold (100), a pressurizing-chamber casing (13) which configures a pressurizing chamber (12) together with the molding object (200), sealing means (14) which airtightly seals a space between the pressurizing-chamber casing (13) and the molding object (200), opening/closing means (15) which opens/closes the space between the pressurizing-chamber casing (13) and the molding object (200), pressurizing means (16) which adjusts atmospheric pressure in the pressurizing chamber (12), heating means (17) which heats either one of or both of the mold (100) and the molding object (200), and degassing means (18) which eliminates any gas present between the mold (100) and the molding object (200).