Process for the fabrication of a hole

Production of a hole (7) in a component (1) using pulsed laser beams comprises using other laser pulse lengths in the first process steps than in the last process step. Preferred Features: Larger or smaller laser pulse lengths are used in the first process step than in the last process step. The las...

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Bibliographische Detailangaben
Hauptverfasser: BECK, THOMAS, BOSTANJOGLO, GEORG
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:Production of a hole (7) in a component (1) using pulsed laser beams comprises using other laser pulse lengths in the first process steps than in the last process step. Preferred Features: Larger or smaller laser pulse lengths are used in the first process step than in the last process step. The laser pulse length is continuously enlarged during the progress of the hole formation from an outer surface (14) of the component to the depth of the hole. The component is a layer system consisting of a substrate (4) and a metallic layer (16) having a composition MCrAlX (where M = Fe, Co or Ni and X = Y or rare earth).