Method for producing a metal structure on a substrate

The method comprises carrying out a polymerization process where a structural electrode (50) is used whose surface has a first area of a predetermined structure such as electrode contact area (46) and a remaining second area such as electrode complementary area (48) and a galvanic process. The electrode contact area is connected with a first voltage potential. A part of the electrode contact area is contacted with liquid first electrolytes, where polymerizable and/or cross-linkable compounds are introduced in the first electrolytes. A first current flow is generated by the first electrolytes. The method comprises carrying out a polymerization process where a structural electrode (50) is used whose surface has a first area of a predetermined structure such as electrode contact area (46) and a remaining second area such as electrode complementary area (48) and a galvanic process. The electrode contact area is connected with a first voltage potential. A part of the electrode contact area is contacted with liquid first electrolytes, where polymerizable and/or cross-linkable compounds are introduced in the first electrolytes. A first current flow is generated by the first electrolytes over the structural electrode. A conductive polymer film such as polymer structure (66) of the predetermined structure is formed on the electrode contact area contacted with the first electrolytes. A part of the polymer structure is contacted with liquid second electrolytes, where a metallic material is introduced in the second electrolytes. A second current flow is generated by the second electrolytes over the polymer structure. A conductive metal film such as metal structure of the predetermined structure is formed and/or deposited on the area of the polymer structure contacted with the second electrolytes. A transfer of the metal structure is carried out on the substrate where a part of the metal structure is introduced on the substrate, and a transfer of the polymer structure is carried out on the substrate where a part of the polymer structure is introduced on the substrate. The metal- and/or polymer structure introduced on the substrate is materially bonded with the substrate by an adhesive agent (substrate adhesive agent) and/or by thermal joining process such as soldering, welding, laminating and/or ultrasonic joining. The substrate adhesive agent is selected, so that an adhesion between the electrode and the polymer structure is weak than an adhesion between the substrate