A sensor in a moulded package and a method for manufacturing the same

The flow sensor or other type of sensor comprises a package (3) having a cylindrical section (6) arranged between an anchor section (5) and a head section (7). The diameter of the anchor section (5) is typically larger than the diameter of the cylindrical section (6), which in turn is typically larg...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Mayer, Felix, Hunziker, Werner
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL METERING BY VOLUME PHYSICS TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	The flow sensor or other type of sensor comprises a package (3) having a cylindrical section (6) arranged between an anchor section (5) and a head section (7). The diameter of the anchor section (5) is typically larger than the diameter of the cylindrical section (6), which in turn is typically larger than the diameter of the head section (7). A sensor chip (1) is embedded partially into the package (3), with a sensitive area (2) being exposed to the surroundings. The sensor can e.g. be inserted into a bore having a diameter matching the one of the cylindrical section (6).