Power semiconductor module and fabrication method thereof

A power semiconductor module comprises a power circuit portion having a power semiconductor chip (113, 111) located on an upper surface of a base (108) having a case (500) on an outer periphery of the base; a printed board (102) with a circuit component mounted thereon, located above the power circu...

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Bibliographische Detailangaben
Hauptverfasser:	Oyama, Kazuhiro, Mori, Mutsuhiro, Koike, Yoshihiko, Saito, Katsuaki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A power semiconductor module comprises a power circuit portion having a power semiconductor chip (113, 111) located on an upper surface of a base (108) having a case (500) on an outer periphery of the base; a printed board (102) with a circuit component mounted thereon, located above the power circuit potion with a space therebetween; a supporter (1031, 1032) which couples the printed board (102) with a cover plate (105) located on an upper portion of the case (500); and silicon gel (101) which is filled in the semiconductor module. An elastic coefficient of all or part of the printed board (102) is smaller than that of the cover plate (105).