DIAPHRAGM FOR A CONDENSER MICROPHONE

A microphone for transducing between an acoustical signal and an electrical signal, comprises a housing and a motor assembly disposed within the housing. The motor assembly includes a backplate and a diaphragm attached to the backplate via a spacer. The diaphragm comprising a ring and a film, the diaphragm vibrates in response to an acoustical signal, wherein the film is formed from an amorphous or semi-crystallized polyphenylene sulfide (PPS) and a metal layer is attached to the film. The film is completely covered by the metal layer and a portion of the metal is removed using a direct energy source, leaving a portion of the film directly exposed resulting in reducing the parasitic capacitances between the backplate and the diaphragm and increasing the sensitivity. Alternatively, the film is partially covered by the metal layer. At least one opening is formed on the microphone and acoustically/electrically coupled to an opening formed on a main printed circuit board of an electronic device, defining a surface mountable microphone.