METHOD FOR PROVIDING A PATTERNED METAL LAYER HAVING HIGH CONDUCTIVITY

Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for elec...

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Hauptverfasser: MALAJOVICH, IRINA, SCHIFFINO, RINALDO, SORIA, KEYS, DALEN, E, ZUMSTEG, FREDRICK, CLAUS, JR, KEUSSEYAN, ROUPEN, LEON, GAO, FENG, JOHNSON, LYNDA, KAYE
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.