WIRE ENAMEL ADHERING WELL TO ELECTRICAL CONDUCTORS
The invention relates to a wire enamel containing A) 20 to 60 percent by weight of at least one binder, B) 40 to 80 percent by weight of at least one organic solvent, C) 0 to 5 percent by weight of auxiliary agents and additives, and D) 0.01 to 5 percent by weight of adhesive. The invention also rel...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention relates to a wire enamel containing A) 20 to 60 percent by weight of at least one binder, B) 40 to 80 percent by weight of at least one organic solvent, C) 0 to 5 percent by weight of auxiliary agents and additives, and D) 0.01 to 5 percent by weight of adhesive. The invention also relates to a method for coating electrical conductors with said wire enamel as well as the use of the wire enamel for coating electrical conductors. |
---|