Semiconductor module with pre-tensioned auxiliary contact spring

The module (2) has a connection element i.e. contact spring (12), provided with a circular contact device, a semi circular contact device and a spring section. The circular contact device is electrically connected with contact surfaces (10) of a substrate (8). Deformation sections are formed at star...

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Bibliographische Detailangaben
1. Verfasser:	LEDERER, MARCO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The module (2) has a connection element i.e. contact spring (12), provided with a circular contact device, a semi circular contact device and a spring section. The circular contact device is electrically connected with contact surfaces (10) of a substrate (8). Deformation sections are formed at start and end points of the semi circular contact device. The contact spring is pressurized with the pressure by stoppers (20, 22) of a pressure piece (6) for pre-stressing the contact spring using the deformation units.