METHOD FOR THE PRODUCTION OF AN ELECTRONIC ASSEMBLY, AND ELECTRONIC ASSEMBLY

The invention relates to a method for the production of an electronic assembly (21), particularly for high-frequency applications, comprising at least one electronic component (9) that is mounted on a printed circuit board (45), and at least one conductor structure (15, 25), by means of which the at...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FREUNDT, DIRK, LIEBING, GERHARD, KUGLER, ANDREAS
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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