METHOD FOR THE PRODUCTION OF AN ELECTRONIC ASSEMBLY, AND ELECTRONIC ASSEMBLY

The invention relates to a method for the production of an electronic assembly (21), particularly for high-frequency applications, comprising at least one electronic component (9) that is mounted on a printed circuit board (45), and at least one conductor structure (15, 25), by means of which the at...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FREUNDT, DIRK, LIEBING, GERHARD, KUGLER, ANDREAS
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a method for the production of an electronic assembly (21), particularly for high-frequency applications, comprising at least one electronic component (9) that is mounted on a printed circuit board (45), and at least one conductor structure (15, 25), by means of which the at least one electronic component (9) is contacted. For this purpose, the at least one electronic component (9) is mounted on an insulating layer (5) of a conductive foil (1). The conductive foil (1) having the at least one electronic component (9) mounted thereon is laminated onto a printed circuit board carrier (13). The structuring of the conductive foil (1) and the contacting of the at least one electronic component (9) forms a conductor structure (15). Soldering points (35) are provided to through-platings (33), which are configured in the electronic assembly (21) and lead to the bottom of the electronic assembly (21), and are connected to the conductor structure (15, 25).