CRACK-FREE EROSION RESISTANT COATINGS ON STEELS

A method for preparing a protective layer (38) on a surface of the substrate (36) that requires a bonding temperature (BT) above a detrimental phase transformation temperature range (28) of the substrate, and then cooling the layer and substrate without cracking the layer or detrimentally transformi...

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Bibliographische Detailangaben
1. Verfasser:	SETH, BRIJ B
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS METALLURGY METALLURGY OF IRON MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A method for preparing a protective layer (38) on a surface of the substrate (36) that requires a bonding temperature (BT) above a detrimental phase transformation temperature range (28) of the substrate, and then cooling the layer and substrate without cracking the layer or detrimentally transforming the substrate. The protective layer (38) and the substrate (36) are cooled from the bonding temperature (BT) to a temperature (46) above the detrimental phase transformation range (28) at a first cooling rate (30) slow enough to avoid cracking the protective layer. Next, the protective layer and the substrate are cooled to a temperature below the detrimental phase transformation range of the substrate at a second cooling rate (27) fast enough to pass the detrimental phase transformation range before a substantial transformation of the substrate into the detrimental phase can occur.