COMPONENT MOUNTING APPARATUS AND METHOD

When mounting first and second mounting parts (3A, 3B, 20), an image of a configuration of the second mounting part (20) is taken and an image-recognition is performed. A plurality of first mounting parts are mounted to a board (1) based on a result of the image-recognition of the configuration of t...

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Bibliographische Detailangaben
Hauptverfasser:	IKURA, KAZUYUKI, NISHINO, TORU
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	When mounting first and second mounting parts (3A, 3B, 20), an image of a configuration of the second mounting part (20) is taken and an image-recognition is performed. A plurality of first mounting parts are mounted to a board (1) based on a result of the image-recognition of the configuration of the second mounting part, and the second mounting part (20) is mounted to the board (1).