BONDING COMPOSITION

A bonding composition (12) contains 0.01-1 wt% of Ge and 0.01 to 1 wt% of Si, and a balance of a Sn alloy. The bonding composition (12) has excellent bonding strength.

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Bibliographische Detailangaben
Hauptverfasser:	HISAZATO, YUUJI, LONG, THAN TRONG
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A bonding composition (12) contains 0.01-1 wt% of Ge and 0.01 to 1 wt% of Si, and a balance of a Sn alloy. The bonding composition (12) has excellent bonding strength.