METHOD AND APPARATUS FOR MOUNTING SOLDER BALL

A part surrounding a mask (3) is raised higher than a region where ball holding holes (3a) are formed, a work (1) is positioned under the ball holding holes (3a) of the mask (3) and the electrodes of the work (1) are aligned with the ball holding holes (3a), solder balls (B) are supplied onto the ma...

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Bibliographische Detailangaben
Hauptverfasser:	ISHIKAWA, SHINJI, HASHINO, EIJI, TATSUMI, KOHEI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A part surrounding a mask (3) is raised higher than a region where ball holding holes (3a) are formed, a work (1) is positioned under the ball holding holes (3a) of the mask (3) and the electrodes of the work (1) are aligned with the ball holding holes (3a), solder balls (B) are supplied onto the mask (3). While the solder balls (B) are being supplied onto the mask (3), the mask (3) is vibrated to move the solder balls (B) across the surface of the mask (3) to drop the solder balls (B) into the solder ball holding holes (3a) and the part surrounding the mask (3) is lowed lower than the ball holding hales (3a) to collect excess solder balls (B) from the mask (3).