METHOD OF PRODUCING A WAFER SCALE PACKAGE

A method for manufacturing a wafer scale package including at least one substrate having replicated optical elements. The method uses two substrates, at least one of which is pre-shaped and has at least one recess in its front surface. Optical elements are replicated on a first substrate by causing...

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Bibliographische Detailangaben
Hauptverfasser: ROSSI, Markus, HEIMGARTNER, Stephan, RUDMANN, Hartmut
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A method for manufacturing a wafer scale package including at least one substrate having replicated optical elements. The method uses two substrates, at least one of which is pre-shaped and has at least one recess in its front surface. Optical elements are replicated on a first substrate by causing a replication tool to abut the first substrate. The second substrate is then attached to the first substrate in an abutting relationship in such a way that the optical element is contained in a cavity formed by the recess in one of the substrates in combination with the other substrate. Thereby, a well defined axial distance between the optical elements and the second substrate is achieved. Consequently, a well defined axial distance between the optical elements and any other objects attached to the second substrate, e.g. further optical elements, image capturing devices, light sources, is also established.