Electrolytic Tin Plating Solution and Electrolytic Tin Plating Method

Electrolytic Tin Plating Solution and Electrolytic Tin Plating Method

A plating solution and a plating method, which does not use a complexing agent and which provides favorable solder wetting properties and an extremely low coupling rate when electrolytic tin plating is performed, and particularly when electrolytic tin plating is performed using a barrel plating meth...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Imanari, Masaaki, Ting, Fai Lung, Ohta, Yasuo, Shimazu, Motoya
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:A plating solution and a plating method, which does not use a complexing agent and which provides favorable solder wetting properties and an extremely low coupling rate when electrolytic tin plating is performed, and particularly when electrolytic tin plating is performed using a barrel plating method.